Chip pressure welding is a technology that connects the chip to the substrate by applying pressure and heat to form a reliable welding connection between the pin of the chip and the pad on the substrate.
The principle is to use the characteristics of thermal expansion and cold contraction, when the heat is applied, the chip and the substrate will expand due to thermal expansion, and the solder paste will also melt to form a welding connection; When cooled, the chip and substrate will shrink due to cold shrinkage, and the solder paste will solidify, fixing the chip and substrate.
Chip pressure welding is a kind of technology to connect the chip to the substrate. By melting the metal solder joints of the chip and the substrate, the strong bond between the metals is generated.
This technology is mainly used in the manufacture of electronic products, which can improve the reliability and performance of electronic components.
The principle is to fuse the chip with the solder joints of the substrate through high temperature and pressure, so that they form a whole. This method can ensure the quality of the solder joint and the firmness of the connection, thereby improving the performance and reliability of the product.
Chip pressure welding refers to the use of welding to apply a certain pressure to complete the welding method, pressure welding is also known as pressure welding. Forging welding, contact welding, friction welding, pressure welding, cold pressure welding, explosive welding belongs to the pressure welding category