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芯片检测设备ichaiyang 2024-05-10 4:09 40
Difference one: the structure of raw materials is different1, the chip is the main raw material of LED, and the chip can emit light freely.2, the chip is a solid-state semiconducto...

The difference between a chip and a chip?

Difference one: the structure of raw materials is different

1, the chip is the main raw material of LED, and the chip can emit light freely.

2, the chip is a solid-state semiconductor device, is a P-N junction, it can directly convert electricity into light.

Difference two, composition is different

1, the composition of the chip: arsenic (AS) aluminum (AL) Gallium (Ga) indium (IN) Phosphorus (P) nitrogen (N) strontium (Si) of several of these elements.

2, the composition of the chip: by the gold pad, P pole, N pole, PN junction, back gold layer (double pad chip without back gold layer) composed.

Difference three: classification is different

1, the chip can be classified according to the luminous brightness, composition elements.

2, the chip can be classified according to the use, color, shape, size.

The difference between a chip and a chip is:

1, the structure of raw materials is different: the chip is the main raw material of LED, and the chip can emit light freely; A chip is a solid-state semiconductor device, a P-N junction, that converts electricity directly into light.

2, the composition is different: the composition of the chip: to have arsenic, aluminum, gallium, indium, phosphorus, nitrogen, strontium several of these elements; The composition of the chip: by the gold pad, P pole, N pole, PN junction, back gold layer (double pad chip without back gold layer) composed.

3, the classification is different: the chip can be classified according to the luminous brightness, composition elements; Chips can be classified according to purpose, color, shape, and size.


difference

Integrated circuit, or microcircuit, microchip, chip (in electronics is a way to miniaturize a circuit (mainly including semiconductor devices, but also including passive components, etc.), and is usually manufactured on the surface of a semiconductor wafer. The aforementioned integrated circuits that manufacture circuits on the surface of semiconductor chips are also known as thin film integrated circuits. Another type of thick film hybrid integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board.

Chip is one of the most important raw materials of LED, is the LED light component, the most core part of LED, chip quality will directly determine the performance of LED. The wafer is composed of group Ⅲ and Group Ⅴ composite semiconductor materials. In the LED package, the chip incoming material is neatly arranged on the chip film.

Wafer generally refers to a thin slice cut from monocrystalline silicon, with a diameter of 6 inches, 8 inches, 12 inches and other specifications, mainly used to produce integrated circuits. The chip is just the raw material, the chip is the finished product.

The chip is composed of transistors, resistors, capacitors through the wire, engraved on the wafer, and finally packaged.