Chip encapsulation is packaging and testing.
Literally, encapsulation is the encapsulation and testing of two layers of meaning. Packaging is the production of qualified wafer welding, plastic sealing, so that the chip circuit and external devices to achieve electrical connection, and to provide mechanical and physical protection for the chip. Testing is to use the test tools provided by integrated circuit design enterprises to test the function and performance of the packaged chip. A chip that is sealed and tested is a fully functional chip.
Chip encapsulation refers to the process in which the wafer that will pass the test is processed according to the product model and its functional requirements, and then the independent chip is obtained. Chip encapsulation is the basis of modern technology, many devices need to use chips, such as mobile phones, computers, etc., because of the composition of these chips will have the current high-tech equipment.