Metal packaging is a process that encapsulates electronic components in metal enclosures. The process generally includes the following steps:
1. Design metal package: According to the characteristics and needs of electronic components, design the shape, size, material and structure of metal package. 2. Manufacturing metal shell: According to the design requirements, select the appropriate metal material, and through stamping, injection molding, casting and other ways to manufacture metal shell. 3. Manufacture electronic components: according to the design requirements, manufacture electronic components, including chip chips, packaged circuits, resistors, capacitors, etc. 4. Connection of electronic components: The electronic components are connected to the inside of the metal shell by welding and other means. 5. Wire connection: The pin of the electronic component is connected to the external wire by welding or connecting head. 6. Encapsulation and sealing: the metal shell is sealed and sealed to ensure that the internal electronic components are not damaged and interfered with by the external environment. 7. Electrical performance test: electrical performance test of metal packaged electronic components to ensure that they meet the design requirements. 8. Packaging and quality inspection: The metal packaging of electronic components, and quality inspection to ensure product quality.
The above is the general process of metal packaging, the specific steps may change, according to different products and needs to adjust.
First of all, prepare metal materials, such as copper, aluminum, etc., and cut, grinding and other processing.
Then, the packaging structure is designed, the packaging mold is made and the injection molding is carried out.
Then, the circuit board is processed by SMT, welding, etc., and the circuit board is put into the package.
Finally, the packaging cover plate installation, welding and other processes, as well as testing and packaging. The entire process requires strict control of the quality of each link to ensure the reliability and stability of the final product.
The encapsulation process is: After passing the slicing process, the wafer from the wafer front process is cut into a small wafer (Die), and then the cut wafer is affixed to the corresponding substrate (lead frame) frame island with glue. Using ultra-fine metal (gold, tin, copper, aluminum) wire or conductive resin, the Bond Pad of the wafer is connected to the corresponding Lead of the substrate, and the required circuit is formed; The individual chips are then protected with a plastic enclosure, and after the molding, a series of operations are performed, such as Post Mold Cure (Post Mold Cure), slitting and molding (Trim& Form, Plating, printing and other processes. After the packaging is completed, the finished product is tested, usually through the Incoming (Incoming), Test (Test) and Packing (Packing) and other processes, and finally into the warehouse and shipment. The typical packaging process is: slice loading, bonding, plastic sealing, flash removal, electroplating, printing, slitting and molding appearance inspection, finished product testing, packaging and shipping.