The chip particle is the core component of the memory, which is the black chip on the memory. The memory particle is also directly related to the performance of the memory, and now the market is more famous Samsung, Hyundai, Micron and other particles!
Particle packaging is actually the type of packaging technology used by memory chips, packaging is to wrap the memory chip to avoid contact with the outside world and prevent the outside world from damaging the chip. Impurities and bad gases in the air, and even water vapor, will corrode the precision circuits on the chip, causing electrical performance to deteriorate. Different packaging technologies differ greatly in manufacturing processes and processes, and packaging also plays a crucial role in the performance of the memory chip itself.
With the rapid development of photoelectric and micro-electric manufacturing technology, electronic products are always developing in the direction of smaller, lighter and cheaper, so the packaging form of chip components is also constantly improved. Chip packaging technology is diverse, DIP, POFP, TSOP, BGA, QFP, CSP and so on, there are no less than 30 kinds, experienced from DIP, TSOP to BGA development process. The packaging technology of the chip has undergone several generations of changes, the performance is increasingly advanced, the ratio of the chip area to the package area is getting closer and closer, the application frequency is getting higher and higher, the temperature resistance is getting better and better, and the number of pins is increasing, the pin spacing is decreasing, the weight is decreasing, the reliability is improving, and the use is more convenient.
Chip particles are the core components of solid-state storage products