one
The steel ring is affixed with a blue film, and the back of the chip is affixed to the blue film;
two
The blue film is placed on the vacuum ring, the vacuum is opened, the blue film is adsorbed, the blue film is sucked flat and fixed;
three
Through the image system, the chip is adjusted to the level, the center of the image is aligned to the center of the wafer cutting path, and the bottom cutter is aligned with the center of the cutting path.
four
Through the short-stroke translation device, the upper split left knife and upper split right knife are aligned to the center of the two cutting paths adjacent to the image center.
five
Adjust the downward pressure of the Z-axis motion device, split the chip at the bottom line of the left knife up and the right knife up, and record the Z-axis coordinates as the chip.
It is the process of cutting wafers into individual chips for testing and packaging processing.
First, a thin film is coated on the wafer, and then the chip layout is formed on the film by etching technology.
The chip is then cut into individual chips using a cutting tool.
Then, the chips are tested and trimmed to ensure the integrity and performance of each chip.
Finally, the chip is packaged and verified to ensure that the chip meets the design standards.
is a very critical innovative manufacturing process that provides high-quality chip products to the chip industry.