1. Single panel production process
For board printing red glue (or tin paste) mount SMT components reflux curing (or welding) inspection test packaging
2, double panel production process
(1) Double panel production process with one side tin paste and one side red glue
Backflow soldering Check the backflow curing Check the backflow curing check the backflow curing check the packaging
(2) Double-sided tin slurry plate production process
Screen solder paste mounting on the first side of the supply board (few IC, few heavy components) Reflow soldering of SMT components Check the second side of the supply board (many IC, many heavy components) screen solder paste mounting
Reflow soldering of SMT components
Inspection package