It refers to the process of packaging and testing semiconductor chips. Generally, the following steps are involved
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1. Chip cutting The wafer is cut into a single chip.
2. Weld the chip to the package substrate.
3. Package The chip and package substrate are packaged together in a plastic or ceramic package.
4. Welding ball connected to the chip welding metal welding ball, used to connect with other circuit boards.
5. Welding pad is connected to the package substrate to weld metal pad for connecting with other circuit boards.
6. Welding test The electrical performance of the welded chip is tested to ensure good welding quality.
7. Functional test The packaged chip is tested to ensure the normal operation of the chip.
8. Screen printing and packaging The relevant information is printed on the package and packaged for transportation and sales.
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The above is a general procedure, the specific process may vary by product and manufacturer.