one Preparation for mounting machine
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1. Prepare relevant product process documents.
2, according to the product process documents of the mounting list material (PCB, components), and check.
3, for the PCB that has been opened, according to the length of opening time and whether it is damp or contaminated, cleaning and baking are carried out.
4. Check the components after opening, and handle the damp components according to the management requirements of SMT process components.
5, according to the specifications and types of components, select the integrated feeder, and correctly install the component braid feeder. When loading -. The center of the component must be aligned with the pickup center of the feeder.
6, equipment status check:
(1) Check that the air pressure of the air compressor should meet the equipment requirements, generally 6kgjf\/cm2 ~ 7kgf\/cm2.
(2) Check and ensure that there are no obstacles in the moving range of guide rail and mounting head, around the automatic replacement nozzle library, and on the tray rack.
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two Start operation of the SMT machine
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1. Start the machine according to the equipment safety technical operating rules.
2, check whether the pressure of the placement machine meets the requirements of the equipment, generally about 5kg\/crri2.
3. Turn on the servo.
4. Return all axes of the mounter to the source position.
5, according to the width of the PCB, adjust the placement machine FT1000A36 guide rail width, the guide rail width should be greater than the PCB width Imm, and ensure that the PCB slide freely on the guide rail.
6, set up and install PCB positioning device:
a, first set the PCB positioning mode according to the operating procedures, generally there are two ways of needle positioning and side positioning.
b, the use of needle positioning should be installed in accordance with the position of the PCB positioning L and adjust the position of the positioning needle, to make the positioning needle just in the middle of the positioning hole of the PCB, so that the PCB up and down freely.
C. If side positioning is used, the position of the stopper and block must be adjusted according to the outline size of the PCB.
7, according to the PCB thickness and outline size of the PCB support needle, to ensure that the force on the PCB is uniform and not loose. If the PCB is mounted on both sides, the position of the PCB support pin must be adjusted after the B (second) side is mounted to ensure that the PCB support pin should avoid the components that have been mounted on the B side.
8, after the setting is complete, you can install the PCB, online programming or patch operation.
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Three. On-line programming
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For products that have completed offline programming, the product program can be directly called out, and for products without CAD coordinate files, online programming can be adopted. Online programming is the process of manually inputting the pick-up and placement program on the SMT machine. The chip picking program is completely compiled and input manually. The chip placement program is to accurately photograph the mounting position of each chip component on the PCB through the teaching camera, automatically calculate the central coordinate of the component (mounting position), and record it in the chip program table, and then manually optimize it.
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Four. Install the chip feeder
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1, according to the off-line programming or online programming of the pick-up program table, the various components are installed on the material station of the placement machine.
2. When installing the feeder, it must be installed in place as required.
3. After installation, it must be checked by inspectors to ensure that it is correct and wrong before it can be tested and produced.
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Five. Make visual images of reference marks and components
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When the automatic SMT machine is mounted, the installation coordinates of the components are calculated from a certain corner of the PCB (generally the lower left or right corner) as the source point. When PCB processing, there is more or less a certain processing error, because the PCB must be calibrated in the high-precision mounting. The reference calibration is carried out by designing the reference mark on the PCB and the optical alignment system of the mounter. The reference mark is divided into PCB reference mark and local reference mark.
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Six. Patch machine parts test and test
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1, program test run program test run generally adopts no mounting components (empty operation) mode, if the test run is normal, it can be formally mounted.
2, test paste out the program file; Test mount PCB blocks according to operating procedures.
3, part inspection
(1) Elm project.
① Whether the specifications, directions and properties of the components on each component bit number are consistent with the process documents (or surface assembly template).
② The components are damaged and the pins are deformed.
(2) Test method. The inspection method shall be determined according to the testing equipment configuration of each unit.
(AOI)。
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Seven. Adjust the program or redo the visual image according to the test and inspection results of the mounter parts
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(1) If the specification, direction and character of the components are wrong, the correction procedure should be carried out in accordance with the process documents.
2, if the PCB component mounting position is offset, use the following methods to adjust.
If the mounting position of all components on the PCB is offset in the same direction, this situation should be solved by correcting the coordinate value of the PCB mark point. The coordinates of the PCB mark point are moved in the direction of the component offset, and the amount of movement is equal to the offset of the component mounting position, and it should be noted that the coordinates of each PCB mark point should be corrected equally.
② If the mounting position of individual components on the PCB is offset, the offset can be estimated to directly correct the patch coordinate value of individual components in the program table, and the correct coordinates can also be re-illuminated by the camera with the method of self-learning programming.
a. Failed to pick up the piece. If the components are not found, consider checking and handling according to the following factors:
The pickup height is not appropriate, due to the component thickness or Z-axis height setting error, check and correct according to the actual value; The picking coordinate is not suitable, possibly because the feeding center of the feeder is not adjusted well, the feeder should be adjusted again; The plastic film of the braid feeder is not torn, usually because the winding belt is not installed in place or the winding pulley is not properly tightened, and the feeder should be readjusted. If the nozzle is blocked, the nozzle should be cleaned. There is dirt or cracks on the end face of the suction nozzle, resulting in air leakage; Suction nozzle type is not suitable, if the diameter is too large to cause air leakage, if the aperture is too small will cause insufficient suction; If the air pressure is insufficient or the gas path is blocked, check whether the gas path is leaking, increase the air pressure or dredge the gas path.
b. If the tablet is discarded or lost frequently, the following methods can be considered for further inspection and treatment:
If the image processing is not correct, the image should be re-photographed; Component pin deformation; The size, shape and color of the components themselves are not relevant, and the abandoned parts can be concentrated and re-photographed for the devices packed in tubes and pallets; Due to improper nozzle model, insufficient vacuum suction and other reasons, the patch flew on the way; There is solder paste or other dirt on the end of the suction nozzle, resulting in air leakage; The end face of the suction nozzle is damaged or cracked, resulting in air leakage.
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Eight. SMT machine continuous mounting production
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In accordance with the operating procedures for production, the following issues should be noted in the mounting process:
1, do not touch the PCB surface with your hand when taking the PCB, to prevent damage to the printed solder paste.
2, when the alarm is displayed, you should press the alarm close button immediately, view the error information and handle it.
3. When supplementing components in the mounting process, pay attention to the model, specification, character and direction of components.
During the mounting process, it is necessary to pay attention to whether the waste material in the waste tank is too high, and clean it in time, so that the waste material cannot be higher than the notch, so as not to damage the mounting head.
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Nine. Product inspection after placement machine
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1, after the self-inspection passed the special inspection, the special inspection passed and then the batch mount.
2, the inspection method and inspection standards are the same as 3.6, 1(6) inspection.
3, there is a narrow distance (lead center distance below 0.65mm), must be fully inspected.
4, narrow spacing, can be extracted every 50 pieces of 1 PCB, 200 pieces of 3 PCB, 500 pieces of 5 PCB, 1000 pieces of 8 PCB sampling rules.
juki3010 patch machine operation tutorial:
1. Turn ON the power supply of the chip machine and place the switch on \"ON\";
2, open the screen display device power supply (green switch), at this time the machine requires ZERO SETTTNG,
Press the START key, the X, Y, Q, D axis of the machine will return to the original position, the machine has been in the zero state, waiting for boot production, juki3010 patch machine operation tutorial successful.