Removal method: (1) Melt more tin on the IC foot, and repeatedly heat the pins with a soldering iron. Because there is more tin, there is a period of time from melting to solidification, and the IC is pulled down with a soldering iron when the tin is not set. The advantage of this method is simple, the disadvantage is that the IC temperature is higher and the time is longer, easy to damage. (2) Blow with a special high temperature hair dryer, and protect the other parts with high temperature tape. The disadvantage is that the IC temperature is higher and the time is longer, and it is easy to damage. (3) Find a length of enameled wire with appropriate thickness, weld one section to the appropriate position of the circuit board, pass the other end through the foot of the IC, pull slightly upward toward the Angle, and at the same time, the iron will heat the force pin, and the tension of the enameled wire will make the pin slightly tilt after the tin is melted, and leave the PCB; Repeat with other pins and change the enamelled wire if necessary. This method is very troublesome, but it is very safe, and generally will not break the IC. Disadvantages: But it seems that doing so is not good for the chip, the heating time is not good to control, and it depends on the speed.