The Surface Mount Device (SMD) is fixed to the motherboard by welding technology. The following is the common chip welding method:
1. Welding raw materials: The raw materials that need to be prepared include chip, motherboard, solder wire, welding pad, etc.
2. Chip layout: According to the circuit design, the chip is placed in the corresponding position on the motherboard. Automatic precision positioning devices are usually used to ensure the accuracy of chip placement. 3. Adhesive coating: Use adhesive (flux) to apply a thin layer of glue on the bottom of the chip to strengthen the adhesion during welding. 4. Welding: Put the motherboard and the chip together in the welding equipment (such as hot gas furnace, reflow furnace, etc.), by controlling the temperature and welding time, so that the solder on the pad can be melted, and the chip and the motherboard can be welded together. 5. Testing: After welding is completed, use professional testing equipment to carry out functional testing and quality testing on the chip to ensure welding quality and connectivity.
6. Package: After the welding is completed, the chip on the mainboard is packaged and fixed as required, usually using glue or the outer coating of the welding disc.
It should be noted that the welding process of the chip requires strict control of factors such as temperature, humidity and static electricity to avoid damage to the chip and ensure welding quality. At the same time, chip welding requires professional operating technology and equipment, and automated production lines are usually used for large-scale production.
The chip is soldered to the motherboard by surface mount technology (SMT). First, the pad on the motherboard is coated with solder paste, and then the patch chip is placed on the pad.
Next, the solder paste is melted by hot air or hot plate heating, and the chip is connected to the solder pad.
Then, through cooling, the solder paste solidifies to ensure that the chip is firmly fixed to the motherboard. This welding method is fast and efficient, and is widely used in the manufacture of electronic products.