Power semiconductor chips are chips that need to withstand high power and high current.
As shown in the picture, it is a power SiC MOSFETs chip, which is about a few millimeters in size. The side you see is the Active side, which is the gate and source, and the back side is the drain.
Through a certain welding mode, it is packaged to become a power MOSFET module. Shown in the figure is the latest power device packaging technology -Cu Clip.
The common power device module shown in the figure is a vehicle MOSFET module, you can see that the chip only accounts for a small volume in the entire module, and most of the Mold resin, Leadframe, wire bonding or cu clip and so on.
The power semiconductor chip is a semiconductor power device that can withstand high voltage and current, and shoulders the heavy task of power amplification, including the amplification circuit of a small signal in advance.