Room temperature superconductors are a very promising material that can achieve zero resistance transport of current at room temperature, while also having a high current density and magnetic field tolerance. The application of room temperature superconductors in the chip field is expected to bring the following advantages:
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1. Higher speed and lower power consumption: Due to the zero resistance characteristics of normal temperature superconductors, the chip does not generate heat when working, which enables higher speed and lower power consumption.
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2. Higher integration: Room temperature superconductors can make very small devices, so the use of room temperature superconductors in the chip can achieve higher integration, thereby improving the performance of the chip.
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3. Higher reliability: normal temperature superconductors have higher current density and magnetic field endurance, so the use of normal temperature superconductors in the chip can improve the reliability of the chip.
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Although the application prospect of room temperature superconductors in the field of chips is very broad, the current research is still in the exploratory stage, and further research and experimental verification are needed.
Room temperature superconductivity has not yet been widely used in chips. Although the research and development and application of normal temperature superconducting materials have always been a hot spot in the fields of physics and materials science, there are still many challenges and problems in the preparation and performance of normal temperature superconducting materials, so their application in microelectronic devices such as chips is still facing great technical difficulties.
In contrast, low-temperature superconducting materials (such as copper oxides) have been successfully used in some microelectronic devices, such as superconducting quantum interferometers, superconducting voltage standards, and so on
Traditional packaging materials can not effectively suppress the electromagnetic interference around the chip, which may lead to the performance of the chip. The use of normal temperature superconducting materials as packaging materials can provide better electromagnetic shielding effect, reduce the interference of external electromagnetic signals to the chip, and improve the working stability and reliability of the chip.