One, silicon wafer
Silicon wafer refers to a thin slice cut from monocrystalline silicon, with a diameter of 6 inches, 8 inches, 12 inches and other specifications, mainly used to produce integrated circuits. Silicon wafer is an important material for making integrated circuits. Various semiconductor devices can be made by means of photolithography and ion implantation.
The current silicon wafer process faces the challenges of cutting line diameter, load, cutting speed and maintenance. Wafer manufacturers must balance these factors to maximize productivity. Wafer thickness is also a factor in productivity, as it relates to the number of wafers produced per silicon rod. The thinner the wafer, the more difficult it is to produce, and the ultra-thin wafer wire saw system must precisely control the process linearity, cutting line speed and pressure, and cutting coolant.
A qualified silicon wafer, the surface can not be damaged, the topography can not be defective, and the requirements for additional back-end processing such as polishing should be minimized.
Two, mask plate
The material of the mask plate is composed of quartz glass, metal chromium and photosensitive glue. In the process of chip manufacturing, the mask plate is the light mask, which can also be understood as the film containing the chip layout information, after exposure, the map in the mask plate is engraved on the wafer.
Generally speaking, the mask plate is made of quartz glass as a substrate, and a layer of metal chromium and photosensitive glue is plated on it to become a photosensitive material. Then the designed circuit pattern is exposed on the photosensitive glue through the electronic laser device, the exposed area will be developed, the circuit pattern is formed on the metal chromium, which becomes a photomask plate similar to the exposed negative, and then applied to the integrated circuit projection positioning, through the integrated circuit lithography machine to carry out light etching of the projected circuit, the production process is as follows: Exposure, development, removal of photosensitive glue, and finally applied to photoetching.
There are semiconductor wafers, germanium, photoresist,