1, the curve temperature set by each manufacturer's BGA repair table is not the same, generally welding lead-free materials, the upper temperature 245, the lower temperature 260 infrared temperature 120 degrees.
2, the I\/O terminals of the BGA Package (Ball Grid Array Package) are distributed in the form of circular or cylindrical solder joints under the package in the form of array, the advantage of BGA technology is that although the number of I\/O pins increases, the pin spacing does not decrease but increases, thereby improving the assembly yield; Although its power consumption increases, BGA can be welded by controlled collapse chip method, which can improve its electric heating performance. The thickness and weight are reduced compared with previous packaging technologies; The parasitic parameter is reduced, the signal transmission delay is small, and the use frequency is greatly increased. Assembly can be coplanar welding, high reliability.