The bonding between the tin mesh and the chip is because the tin mesh plays a protective and positioning role in the welding process. The solder mesh can effectively block the area around the chip that does not need to be welded, and can also provide accurate positioning of the welding position.
By applying solder paste to the solder mesh, then placing the chip in the appropriate position, and then hot pressing or hot air heating, the solder paste will melt and bond the solder mesh and chip together.
This bonding action can ensure the accuracy and firmness of the welding, thus ensuring the normal operation and reliability of the chip.