The main steps of chip loading include:
Grinding: the opposite side of the chip (non-wired side) according to the process standard, customer requirements or some special requirements to grind off a layer, so that the thickness of the chip meets the requirements.
Scribing: The scribing knife (or other means such as laser) is used to cut the scribing slot on the wafer, so that the whole large wafer is divided into many small chips (single chips) to facilitate the loading of the wafer.
Loading: Remove a single chip from a large round chip with a suction nozzle and install it on the base island of the lead frame. At this time, the back of the chip must be glued to the base island with an adhesive. Ball welding: A certain point on the chip (pressure welding area) is connected to the appropriate position of the lead frame (second point) with a gold wire (at a certain temperature, ultrasound, pressure).
Encapsulation: The chip installed on the lead frame is sealed with a resin body to protect and support the chip.
Post-curing: further curing the resin after encapsulation.
Plating: A layer of tin is plated on all parts of the lead line to ensure the solderability of the product pin.
Printing: Marking the resin body, indicating the model number of the product and other relevant information.
Punching forming: The whole product is cut into a single product.
Testing: Testing the product to make sure it is functioning properly.
Packaging: Packaging of products to facilitate transportation and storage.
Warehousing: The product is stored in the warehouse, waiting for delivery.
The specific loading method will vary according to different chip types and process requirements, it is recommended to consult a professional for specific information.
The general steps of chip loading include: selecting the appropriate chip, cleaning and drying the chip location, placing the chip in the specified position using a vacuum cup or mechanical device, checking and confirming the position and fit of the chip, and finally performing a quality check and recording. The specific methods vary by equipment and process and usually require specialized skills and experience.
LED packaging process chip inspection - crystal expansion - dispensing (prepare) - Manual piercing (automatic mounting) - Sintering - pressure welding - sealing - curing and post-curing - cutting and slicing - Chip inspection - Crystal expansion: 1mm to 0.6mm - Dispensing: GaAs, SiC conductive substrate, red light, yellow light, yellow green chip with back electrode, using silver glue.