Intelligent core Sensor has six core technologies, developed the world's first Sensor & ASIC (monolithic integrated sensor), and always benchtop foreign high-end imported products. In the aspect of high precision AD design, variable rate multi-stage structure is adopted.3, Kirin 9000 series: Huawei self-developed high-end chip, using 5nm process manufacturing, integrated advanced core technology and artificial intelligence algorithm, with excellent performance and low power consumption characteristics. Kirin 820 series: mid-to-high-end chips, manufactured with a 7nm process, with excellent performance and low power consumption.
4, the world chip ranking first is TSMC. Taiwan Semiconductor Manufacturing Company (TSMC) is the world's largest foundry and the world's largest chipmaker. TSMC has advanced process technology and is able to provide customers with a variety of products ranging from 2 nm to 90 nmProcess node.
5, Mediatek technology is famous for advanced multimedia and artificial intelligence technology, the core business of Mediatek technology includes mobile communication, smart home and automotive electronics. Hynix Hynix chip manufacturer, originated from the Korean brand English abbreviation "HY". Hynix is the original modern memory, changed its name to Hynix in 2001.
6, what is the concept of nano chip semiconductor stocks leading stocks are as follows: SMIC China's large scale, advanced technology integrated circuit chip manufacturing enterprises. Smic's main business is based on the integrated circuits of customers themselves or third partiesDesigned to manufacture integrated circuit chips for customers.
The Chinese science and technology industry ushered in an exciting innovation breakthrough, a new milestone of independent core making - the 12nm process storage and computing integrated intelligent driving chip Hongtu H30 launched by Houmo Intelligence, which strongly refreshed the performance list of domestic chips with excellent performance.
October 10, after Mo Intelligence released intelligent driving chip Hongtu H30, the chip physical computing power up to 256TOPS@INT8, with the highly sought after 256TOPS Nvidia Orin X, typical power consumption is only 35W, the high energy efficiency ratio can be seen.
The intelligent driving solution created by Hongtu H30 has been deployed on the unmanned car of Neolithic, which is also the first time in the industry that the chip based on the integrated storage architecture successfully runs the end-to-end intelligent driving technology stack.
Simply put, currently TSMC and Samsung produce 5nm coresAt the same time, it uses FinFET (fin field effect transistor) technology. The GAAFET technology used in Samsung's 3nm chip is considered to be the next generation of FinFET technology. The advantage of this technology is that it is well constructed, and the chip using FinFET technology can accommodate more transistors.
Chip raw materials are mainly silicon, manufacturing chips also need an important material is metal. The integrated circuit manufactured on the surface of a semiconductor chip is also known as a thin-film integrated circuit.
Third, the link that needs to make up the weak board, in the semiconductor industryAt present, we have a strong company such as Hisilx in chip design, but in the production link is not advantageous, the most competitive is SMIC, has been able to mass produce 14nm process chips, but higher technology wafer foundry needs to rely on the Dutch ASML lithography machine.
Electronic Science and technology: This major is a comprehensive major, involving physics, information technology, computer and other aspects of knowledge.
After the inspection is passed, we need to package the chip, secure the wafer and bind the corresponding pins. Even if it's the same kind of chip, it's sealedThe form of installation may be different, generally there are DIP, QFP, PLCC, QFN and so on.
The production process and principle of the chip are as follows: The production process of the chip is simply to deposit a layer of gold on a piece of glass, and then the part of this layer of gold is heated and melted and poured to the bottom of the substrate. And then an etching is done in this place, which is to carve an integrated circuit into this gold surface.
The production process of the chip generally has the preparation of semiconductor materials,Wafer preparation, lithography, etching, cleaning and testing; The principle is based on the theory of semiconductor properties. Production process: Preparation of semiconductor materials The materials for chip manufacturing are semiconductor materials, such as silicon, germanium, etc.
The same chip core can have different packaging forms, the reason is that the chip is fixed, the pin is bundled, and different packaging forms are made according to needs. For example: DIP, QFP, PLCC, QFN, etc., which mainly depends on the user's application habits, application environment, market shape and other peripheral factors.
The process of making chips is essentially in siliconThe process of making transistors on the material.
The raw material wafer of the chip, the composition of the wafer is silicon, is extracted from quartz sand, and the wafer is the purified silicon element (9999%). Then, some of the pure silicon is made into silicon crystal rods, which become the material for the manufacture of integrated circuits in time semiconductors. Slicing them is a special requirement for chip manufacturing.
Chinese chips ranked fourth in the world. The Semiconductor Industry Association (SIA) predicts thatThe share of Chinese companies in the global semiconductor market will grow from 9% in 2020 to 14% in 2024, which means China will become the world's third largest semiconductor producer after the United States and South Korea.
Chinese chips rank fourth in the world. According to the data released by the National Research Center for the second quarter of 2023, Mediatek still leads the list with a 30% market share. Qualcomm ranked second and third with 29 percent market share and Apple with 19 percent.
Chinese chips are now in the forefront of the world, but with foreign coresThere is still a certain gap between the films. China's chip foot is mainly reflected in the lithography machine technology, because we use the Dutch lithography machine technology, in our country has not yet manufactured high-quality lithography machine technology.
Qualcomm Qualcomm was founded in 1985, headquartered in San Diego, California. Business scope involved in radio communication technology research and development, chip research and development, is the world's leading wireless technology innovator.