The performance of the Kirin 820 belongs to the current medium and high-end level.
Kirin 820, a mobile device chip developed by hisilicon Semiconductor Co., LTD., is Huawei's first platform for the mainstream smartphone market. On March 30, 2020, the second product of Huawei Kirin 8 series SoC processor Kirin 820 was officially released, which was first launched by Honor 30S and equipped with Kirin 820 using TSMC 7nm process, integrating the flagship 5G baseband module of the same model Kirin 990 5G, supporting 2G\/3G\/4G\/5G multi-standard. In particular, 5G supports SA\/NSA dual-mode, supports the five bands of the three major operators N1\/N3\/N41\/N78\/N79, supports smart dual cards, and does not miss the call from another card during the call.
The Kirin 820 integrates eight CPU cores, including a high-performance large-core A76 2.36GHz, three energy-efficient mid-core A76 2.22GHz, and four energy-efficient small-core A55 1.84GHz, which improves multi-core performance by 27% compared to the Kirin 810, and integrates six core Mali-G57 Gpus. It also supports GPU Turbo and Kirin Gaming 2.0 technologies.
Mid-level.
The Kirin 820 uses TSMC's 7nm process, which, please note, is not the latest 7nm EUV. In terms of technology, the Kirin 820 lags behind the Snapdragon 765G and Huben T7520 in the same class of 5G SOCs.