The Kirin 710 will be manufactured using TSMC's 12-nanometer process and will use an autonomous architecture based on the ARM A73 public version, with processing performance between the Kirin 960 and Kirin 970. In addition, the Kirin 710 will also integrate a separate NPU neural network unit like the Kirin 970 for AI acceleration in daily use of mobile phones.
In contrast, Qualcomm Snapdragon 710 is manufactured by Samsung 10nm process, integrated two A75 and six A55 CPU cores, Adreno 616 GPU graphics core, AI performance than Snapdragon 660 is up to 2 times. In addition, Taiwan's Electronic Times also mentioned that the Kirin 710 chip is expected to be released in July, and the first model is likely to be HUAWEI Nova 3 mobile phone, equipped with 19.5:9 fringe full screen, auxiliary rear dual camera.
There's no Kirin 7100. It's a 12-nanometer Kirin 710
The Hisilicon Kirin 710 is built using TSMC's 12-nanometer process, and the specific architecture of the CPU is four A73 large cores and four A53 small cores, with a maximum main frequency of 2.2Ghz. In fact, such a size of the core configuration and Qualcomm Snapdragon 660 is relatively close, and the running score is naturally similar. From the recently exposed running score, the single-core running score of Hisilink Kirin 710 is 1600 points, and the multi-core running score is about 5400 points, which is very close to the Qualcomm Snapdragon 660.
This processor is built using a 12nm process, the highest frequency can reach 2.2GHZ, compared to the traditional Kirin 659, its performance can be improved by about 70%.