Integrated circuit sealing test three leading [Tongfu micro] [Huatian Technology] [Changdian technology], Dagang shares, etc.
Tongfu Microelectric (chip packaging leader) : Main business: integrated circuit chip packaging and testing.
Industry advantages: The largest domestic integrated circuit packaging and testing enterprise with the most product varieties, and the first domestic company to break through the 5-nanometer sealing test.
Dagang Shares: Sun Company Suzhou Keyang is one of the few companies that master wafer-level chip packaging technology.
Changdian Technology: integrated circuit packaging and testing leading enterprises.