First of all, we must understand these concepts:
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(A) Huawei Hisilicon: enterprise abbreviation, Hisilicon Semiconductor Co., LTD. Hisilicon Semiconductor Co., Ltd. was established in October 2004, the predecessor of Huawei Integrated Circuit Design Center founded in 1991.
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Hisilicon is headquartered in Shenzhen, with design offices in Beijing, Shanghai, Silicon Valley and Sweden. Hisilicon's products cover wireless network, fixed network, digital media and other fields of chips and solutions, successfully used in more than 100 countries and regions around the world; In the field of digital media, it has launched network monitoring chips and solutions, video phone chips and solutions, DVB chips and solutions, and IPTV chips and solutions.
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(2) Kirin: It is a chip series.
At present, hisilicon has a total of five series of chips, which are used for smart devices Kirin series; Kunpeng series for data centers; Ascend series SoC, a scenario AI chipset for artificial intelligence; Used to connect chips (base station chip Tiangang, terminal chip Balong); Other dedicated chips (video surveillance, set-top box chips, Internet of Things, etc.).
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To put it simply, Huawei's chips have different series of chips according to different uses, which are called Kirin for mobile phones, Kunpeng for data centers, Shengteng for artificial intelligence scenarios, and so on.
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(3) Hongmeng: In the introduction of HarmonyOS, Huawei defines it as a \"microkernel-based full-scene distributed OS\
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Huawei Hongmeng operating system adopts a microkernel distributed architecture, mainly the iot device end, and will be applied to low-latency scenarios such as automatic driving, smart home, and remote health care. The release of HarmonyOS aims to promote the construction of the Internet of everything ecosystem and achieve a full-scene smart ecology.
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In other words, Hongmeng is the operating system, belongs to the software; Kirin and other chips are hardware.