The 28nm chip requires the use of high-resolution, high-precision photoresist. Photoresist is a key material in the fabrication of chips. It plays a role as a medium between the lithographic template and the surface of the chip. The 28nm chip has high integration and density, requiring higher resolution and accuracy of the photoresist, which can achieve smaller graphic size and higher pattern accuracy. The common 28nm chip photoresist has two types of positive and negative adhesive, which can be selected according to specific needs.
Positive adhesive has high resolution and accuracy, which is suitable for high density and high performance chip manufacturing. The negative glue is suitable for larger size pattern production. Choosing the right photoresist is crucial to ensure the quality and performance of 28nm chip manufacturing.
ArF photoresist can increase the number of photoresist uses with double\/multiple exposure technology, theoretically can be used in 7~28nm process chips.