The Lin 820 is manufactured using TSMC's 7nm process
Kirin 820 integrates the flagship 5G baseband module of Kirin 990 5G, supports 2G\/3G\/4G\/5G multi-standard, especially 5G supports SA\/NSA dual-mode, supports the five bands of the three major operators N1\/N3\/N41\/N78\/N79, supports smart dual-card, and does not miss the call from another card during the call.
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The Kirin 820 integrates eight CPU cores, including a high-performance large-core A76 2.36GHz, three energy-efficient mid-core A76 2.22GHz, and four energy-efficient small-core A55 1.84GHz, which improves multi-core performance by 27% compared to the Kirin 810, and integrates six core Mali-G57 Gpus. It also supports GPU Turbo and Kirin Gaming 2.0 technologies. At the same time, there is also a self-developed architecture NPU unit, a single large core.
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Kirin ISP 5.0 image processing unit, supporting BM3D SLR level image noise reduction, video dual-domain noise reduction.
Seven nanometers.
Huawei Kirin 820 adopts TSMC 7nm manufacturing process.
This is also TSMC's second 5G chip, the Kirin 820, after the Kirin 990 processor, which has pushed up the high capacity utilization rate of the 7nm process.