A process of 28 nanometers or even 45 nanometers is sufficient.
Air conditioning chips are mainly divided into two categories: one is IPM module, one is MCU chip. IPM is the core chip of the whole outdoor unit inverter electric control, and Midea already has the core intellectual property rights of IPM.
Chips are mainly divided into three areas: design, manufacturing and packaging. At present, the chip design and packaging industry in China has developed rapidly, and the main backward is in manufacturing. Due to multiple factors such as technology, equipment and materials, the mainland's wafer manufacturing plants have been in a catch-up state for many years.
The chips used in ordinary home appliances are 14-nanometer chips.
The domestic air conditioning chip is 16 nanometers.
Most of the current processor chips are by TSMC, and the 16 nm launched by TSMC, its biggest feature is the introduction of FinFet structure technology, compared with other 14 nm or 28 nm, in power consumption and performance has been greatly improved.