It's high, but it's not the highest.
4nm mobile phone chip packaging technology belongs to the packaging technology of high-end chips, but it belongs to the latter process in the entire chip manufacturing process, and the technical level is far less than the former lithography technology. Chip packaging is to add protective shell, fixed seal, circuit pin to the processed chip. A former euv lithography machine weighs 180 tons, the price is more than one billion, and the packaging equipment is only a few tons, the price is tens of millions, the difference between the two is very large, so the packaging technology is relatively not too high.
ahead
The chip manufacturing process is very complex, mainly divided into three links, one is chip design, Huawei Hisilicon is strong in this respect, the Kirin chip used in Huawei mobile phone is designed by Huawei Hisilicon, and then handed over to TSMC and other chip foundry for production. So after Huawei was cut off, the chips designed by Huawei Hisilicon could not be OEM.