The production process of Huawei's 5G chips is a complex technological process. First, Huawei needs to design the architecture and circuit diagram of the chip, and conduct simulation and verification.
They then used advanced manufacturing processes to turn the circuit diagram into the actual chip. This process includes steps such as photolithography, thin film deposition, ion implantation, and metal evaporation.
Next, the chip is tested and debugged to ensure its performance and quality.
Finally, the chip is packaged and tested, and then installed into the device. The whole process requires strict quality control and sophisticated equipment to ensure the stability and reliability of the chip.
The nearest 5G chip Kirin 9000 is designed by Huawei Hisilicon and manufactured by TSMC.
Huawei 5g chips can not be produced at present, mainly due to the restrictions of the United States.