so-8 is packaged in vinyl.
The packaging process is as follows:
The first step: crystal expansion. The expansion machine is used to evenly expand the entire LED wafer film provided by the manufacturer, so that the closely arranged LED grains attached to the surface of the film are pulled apart, which is easy to Pierce the crystals.
Step 2: Back the glue. Place the expanded crystal ring on the surface of the glue machine that has scraped the silver paste layer, and carry the silver paste on the back. Light the silver paste. Suitable for bulk LED chips. Use the dispenser to point the appropriate amount of silver paste on the PCB printed circuit board.
Step 3: Put the crystal expanding ring prepared with silver paste into the crystal holder, and the LED chip is stabbed on the PCB printed circuit board by the operator under the microscope with the crystal pen.
Step 4: Put the PCB printed circuit board with good crystal into the hot circulation oven and stand at a constant temperature for a period of time, to be removed after the silver paste is cured (not long, otherwise the LED chip coating will bake yellow, that is, oxidation, causing difficulties to the bond). If there is an LED chip bond, the above steps are required; If only IC chip state rule, cancel the above step.
Step 5: Stick the chip. Use a dispensing machine to apply an appropriate amount of red glue (or black glue) to the IC position of the PCB printed circuit board, and then use an anti-static device (vacuum pen or tube) to correctly place the IC nude on the red glue or black glue.
Step 6: Dry. Put the glued bare piece into the hot circulation oven and put it on the large flat heating plate to stand at constant temperature for a period of time, or it can be cured naturally (for a long time).
Step 7: Bunding (line). The aluminum wire welding machine is used to bridge the wafer (LED grain or IC chip) with the corresponding solder plate aluminum wire on the PCB board, that is, the inner lead of the COB is welded.
Step 8: Pre-test. Use special testing tools (there are different equipment according to different uses of COB, simple is high precision voltage regulation power supply) to test the COB board, and the unqualified board is repaired.
Step 9: Dispense glue. The dispensing machine is used to place the right amount of the prepared AB glue on the good LED grain, and the IC is packaged with black glue, and then the appearance is packaged according to customer requirements.
Step 10: Cure. The sealed PCB printed circuit board is placed in the hot circulation oven at constant temperature, and different drying times can be set according to requirements.
Step 11: Post-test. The packaged PCB printed circuit board is then tested for electrical performance with a special detection tool to distinguish good from bad.
Step 12: Polish. According to customer requirements for product thickness grinding (generally soft PCB).
Step 13: Wash. Clean the product.
Step 14: Air dry. Air dry the clean product twice.
Step 15: Test. Success is determined in this step, (there is no better way to remedy the bad film).
Step 16: Cut. Cut large PCBS to the size required by the customer
Step 17: Packaging, delivery. Package the product.