The following is my answer, the three-nanometer chip manufacturing process is a highly complex and sophisticated technical process. It involves several key steps, including wafer preparation, lithography, plating, packaging, and testing. Among them, the lithography process is the core step, through extreme ultraviolet lithography technology, electronic components and connections are precisely engraved on the wafer surface. In addition, the 3nm process uses advanced material and structural design to achieve higher integration, performance and low power consumption. The entire manufacturing process requires advanced scientific research and engineering support to ensure the chip's quality and performance reach the optimal level.