As of 2021, the current minimum manufacturing process for mass-produced chips has reached 5 nanometers (nm). The 5-nanometer process chips, produced by companies such as Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics, use an advanced FinFET structure and multi-level transistor design that enables higher integration and lower power consumption. In addition, many companies are also working to develop more advanced 3 nanometer (nm) process technologies, which are expected to achieve mass production in the next few years.
The smallest mass-produced chip is 4nm, and the thinnest chip is 25000nm thick.
The thinnest chips available today can do 25,000 nm, or 25 microns. Ordinary wafers are about 600 microns, and after grinding, polishing, etching and other processes, they are generally two or three hundred microns thin, but now the thinest flexible chips can be 25 microns, which is 25000nm. However, the thickness of the chip is not too important, the most important thing is the chip manufacturing process, and the highest production process of the chip is 4nm.