The 14nm laminated package is hisilicon's chip technology.
The so-called 14nm laminated packaging technology is not worth stacking in the physical sense, but multi-chip processing tasks through division of labor, and then summary processing to achieve 7nm computing efficiency, there is no problem with this technology, that is, power consumption and multi-chip support is proportional, and the chip cost produced by this technology is very high, the production capacity may not be too high. Maybe the technology can be upgraded to optimize it later.