The three core technologies, including FPGA, design software, and semiconductor equipment, are the three major semiconductor infrastructure devices that need to be broken through.
Fpgas are known as versatile chips that can be quickly programmed into a single chip. This is a powerful weapon for small-batch chips and is now an essential part of many companies' chip designs. At present, the largest companies in FPGA, Xilinx (Xilinx), Altera (Altera), Lattice (Lattice), Microsemi(Megaco Senmei), are all American companies. Xilinx (Xilinx) and Altera (Altra) accounted for 90% of sales, of which Altera has been acquired by Intel. AMD may acquire Xilinx for more than $30 billion, which means that the two largest FPGA companies are swallowed by the two X86 processor companies in the United States.
At present, China has promoted the development of the semiconductor industry to a strategic height, listed the semiconductor industry as a national key development industry, invested a lot of funds and talents, in order to make a breakthrough in technology, and strive to embark on the road of independent research and development and self-sufficiency as soon as possible. At present, the core technologies in the following areas need to be broken through.
Lithography system, which is the core of the chip manufacturing core, lithography is the most complex and critical process step in the semiconductor chip production process, which is time-consuming and costly. The difficulty and key point of semiconductor chip production is to transfer the circuit diagram from the mask to the silicon wafer, which is realized by lithography, and the process level of lithography directly determines the process level and performance level of the chip.
The core technology of semiconductor is integration, and the smaller the chip, the higher the integration, the higher the technical content and gold content.