The following is my answer, integrated circuit package type is a very important part of electronic engineering, which determines the performance, reliability and cost of integrated circuits. Common IC package types include the following:
DIP dual in-line package: This is the earliest form of IC package, it has the advantages of simplicity, low cost, high reliability, so it is still widely used in many occasions.
SOP Small package: With the reduction of integrated circuit chip size, SOP package is gradually becoming mainstream. It has the advantages of small size, light weight and low cost, and is suitable for large-scale production. QFP four-sided flat package: QFP package is a common form of integrated circuit package, it has the advantages of small size, light weight, low cost, suitable for surface mount technology.
BGA ball grid array package: BGA package is an advanced integrated circuit package form, it has the advantages of small size, light weight, high reliability, excellent electrical performance and so on, suitable for high-speed, high-density integrated circuits.
The above are common integrated circuit packaging types, and with the continuous development of technology, new packaging forms are constantly emerging.
The main packaging types of integrated circuits are plastic packaging, ceramic packaging, metal packaging and glass packaging. Among them, plastic-encapsulated integrated circuits have the advantages of low cost and easy large-scale production, and are the most widely used.
Ceramic packaging is mainly used in high-end products, with high temperature resistance and high stability. Metal packaging is mainly used for high-power electronic equipment, with good heat dissipation performance.
Glass packaging and plastic packaging is similar, but more advanced, mainly used in high-end products.
< br >
DIP dual-in-line package, DIP refers to the use of dual-in-line package of integrated circuit chips, the vast majority of small and medium-sized integrated circuits (ics) are used in this form of packaging, the number of pins is generally not more than 100. An IC packaged in DIP has two rows of pins that need to be plugged into a chip socket with a DIP structure.