The technical solution of stacked chips was first proposed by Japan's NEC Corporation in 1987. It refers to the integration of multiple physical chips and packages into a whole, and the interconnection and data transmission between chips are realized through microscopic observation and precise control.
This chip design scheme can greatly reduce the space size of electronic products, improve the efficiency of power use and simplify product manufacturing costs, and become an indispensable part of many terminal devices such as the Internet, the Internet of things, smart phones, smart homes, and lead one of the trends of semiconductor technology development in the future. With the continuous innovation and advancement of new materials, manufacturing processes and design tools, stacking chips _