The chip manufacturing department is mainly responsible for the manufacturing process of chips, including design, manufacturing, testing and packaging.
First, the design process is to design the circuit structure and function of the chip according to the requirements and specifications, using hardware description language (HDL) and related design software. This link needs to consider the power consumption, performance and area of the chip to achieve the optimal design. Second, the manufacturing process is to make the designed chip. This process requires the use of semiconductor materials and sophisticated manufacturing equipment, through a series of complex process steps, the circuit structure into the actual chip.
In addition, the testing process is to test the function and performance of the manufactured chip to ensure that it meets the design requirements. This link requires the use of special test equipment and test software to simulate and verify the chip to ensure that it can work properly in practical applications.
Finally, the packaging step is to package and protect the tested chip so that it can adapt to the external environment and ensure its reliability. This process requires the use of sophisticated packaging equipment and materials to package the chip into a standalone device or module.
In short, the chip manufacturing department is the department responsible for making the designed chips and ensuring their quality and reliability. The work of this department requires a high degree of expertise and skill to ensure that the chips produced can meet the needs of a variety of applications.
Incidental manufacturing refers to the department that directly produces chips. After the chip is designed online, the manufacturers that need to produce representatives here have Foxconn and so on.