1, in the past, China's lithography machine can only reach 50 nm production accuracy, however, in recent years, seize the opportunity, vigorously develop technology, China's lithography machine successfully achieved 25 nm and 18 nm production accuracySuccessfully pushed the industrial chain to a higher level.
2, the Chinese lithography machine now reaches 22 nanometers. Before the breakthrough in microelectronics technology in Shanghai, China's domestic lithography machines have been stuck in the manufacture of chips with a 90nm process. This time, China has directly broken through from 90nm to 22nm, which means that China has achieved localization in some key core areas of lithography.
3, nano. According to the Chinese People's Daily Online, China has successfully developed the first domestic 28-nanometer (nm) lithography machine in 2023, which is expected to be delivered by the end of the yearUse.
1. Shenzhou Loongson GPU is jointly developed by the Institute of Computing Technology of Chinese Academy of Sciences and Shenzhou Technology Company. It can provide efficient graphics performance, support open source software and API interface, and is the first GPU chip launched in China.
2, China's chip ranking first is Hisilicon. First place goes to Hayes. Hisilicon, which evolved from Huawei's Integrated Circuit Design Center, is Huawei's main chip research and development center.
3, China's chip rankingThe first introduction is as follows: SMIC is the largest wafer foundry in China, which basically represents the cutting-edge technology of domestic chips.
4, Longxin Zhongke Technology Co., Ltd. is a well-known chip brand, high-tech enterprises, national planning layout of integrated circuit design enterprises. Its Longson 1 is the earliest 32-bit general CPU chip in China, and the company is committed to the design, production, sales and service of the Longson series CPU.
5, and the IGBT chip, like the 7nm and 5nm integrated circuit chips we mention daily, is also the national 02 specialThe key support projects. The 02 special project refers to the second of the 16 major technological breakthrough projects in the 12th Five-Year Plan period. In other words, this chip is the most technologically advanced product in power electronics.
6, the latter is the external memory chip (external memory), refers to the memory chip other than memory and cache. This kind of memory chip can still save data after power failure, slow speed, large capacity and low price.
1, the nanoscale division of the chip includes 3nm, 5nm, 7nm,14nm, etc. Among them, the nanometer level refers to the gate length of the CMOS device, that is, the minimum wiring width or processing size. Globally, TSMC and Samsung's 3nm process technology is more advanced, but the current yield of Samsung's 3nm is only 10-20%.
2, chip 3nm, 5nm, 7nm refers to the use of 3nm, 5nm, 7nm process of a chip, nm is naturally the length of the unit nano for short. Simply speaking, x nm refers to the gate width of the complementary oxide-metal semiconductor field effect transistor formed on the CPU, also known as the gate length.
3, the 28nm, 14nm and 7nm of the chip process represent the size of the transistor gate in the semiconductor manufacturing process. The smaller the gate size, the more integrated the transistor, and the more transistors can be made on the chip. The 28nm process is a milestone in semiconductor manufacturing.
4, transistor density: the number of transistors per square millimeter in the 3nm process is more than 35 million, and in the 7nm process is about 15 million. This means that the 3nm process has a higher transistor density, allowing the chip to accommodate more transistors and thus improveIts performance and functionality.
Domestic chip level can only achieve 90 nm. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm. High-end KrF and ArF photoresist are almost dependent on imports, of which ArF photoresist is almost zero domestic.
China's chip manufacturing process level At present, China's chip manufacturing process level hasUp to 14 nanometers, this level can meet the needs of most application scenarios. In the future, the manufacturing process of Chinese chips will be further improved, and it is expected that by 2025, the manufacturing process of Chinese chips will reach 7 nanometers.
nano. According to Baidu Encyclopedia information shows that China can produce 14-nanometer chips by September 25, 2023, with a mass production rate of 95 percent. A chip is an electronic component, manufactured by microelectronics technology, that integrates circuits and systems on a tiny piece of silicon.
China's domestic chip can reach 90 nanometers. Domestic chip levelOnly 90 nanometers. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm.
The Chinese lithography machine now reaches 22 nanometers. Before the breakthrough in microelectronics technology in Shanghai, China's domestic lithography machines have been stuck in the manufacture of chips with a 90nm process. This time, China has directly broken through from 90nm to 22nm, which means that China has achieved localization in some key core areas of lithography.
In the past, Chinese lithography machines could only