1) In 2001, the chip manufacturing process at that time was 130 nm, and the Pentium 3 processor we used at that time was 130 nm.
2) In 2004, it was the first year of 90 nm, that year Pentium 4 used 90 nm process, and the performance was further improved.
At that time, there were many manufacturers that could achieve the 90-nanometer manufacturing process, such as Intel, Infineon, Texas Instruments, IBM, as well as UMC and TSMC
3) In 2012, the process technology developed to 22 nm, at this time, Intel, UMC, Mediatek, GE Chip, TSMC, Samsung, etc., there are still many manufacturers in the world can reach 22 nm semiconductor process technology.
4) 2015 became a watershed in the development of chip manufacturing, when the process entered 14 nm, UMC (Taiwan UMC) stopped there.
5) In 2017, the process entered 10 nm, Intel fell in 10 nm, once Intel chip manufacturing process alone in the world, TSMC Samsung and so on are behind the chase.
However, when the process entered 10 nm, Intel's 10 nm chip could only be used on low-end machines, and Intel's main I5 and I7 processors could not be delivered due to yield problems.
In the field of 7 nm, Intel is still unable to break through, and another chip foundry giant in the United States, \"GF\
6) In 2018, the process stepped into 7 nm
Gf announced to give up 7 nm, in the previous article \"The enemy will not be merciful\
However, because of the cost and difficulty of 7nm research and development, GF finally decided to abandon 7nm.
Thus, the US government has included \"TSMC\" in the US military partners, and is ready to sign a chip foundry partnership agreement with the US government after 2024 with TSMC.
Because of 7-nanometer technology, TSMC is regarded as \"one of our own\" by the U.S. government, and in order to supply the United States for a long time, TSMC also announced a $12 billion plan to build a factory in the United States.
The United States' own OEM leader Intel fell at 10 nm, GF fell at 7 nm, and entered the more difficult 5 nm, leaving only Samsung and TSMC.
7) The introduction of 6nm mass production will be released in 2019, and the process will enter 5nm mass production in 2020
However, Samsung 5 nano was launched at the beginning of the year, and there is still a long way to go from mass production and high yield, the premise of chip foundry, first launch, trial production, and formal mass production, these three stages are more important than one.
Samsung's yield at 14 nm is not as good as TSMC's, its efficiency at 10 nm is not as good as TSMC's, and its R&D process at 7 nm is not as good as TSMC's.
You can only talk about success when you reach formal mass production and high yield, and TSMC is the only foundry in the world with the power to produce 5 nanometers.
Looking at the development of the entire chip process, it is really a lot of blood and tears, even if powerful foreign manufacturers such as IBM, Intel, and GF are also said to fall down and give up
This is a very difficult project, there is a high probability of failure, and success requires a real sense of killing a bloody road.
8) TSMC plans to introduce 3nm into mass production in 2022, which is absolutely unique in the world
9) SMIC will mass-produce 14nm chips in 2019
In the further 7-nanometer field (performance is 20% higher than 14 nm, energy consumption is 50% lower), the core is still challenging, trial production at the end of the year, but it is still far from mass production.
But this is already very not easy, there are only three 7nm players in the world, a TSMC, a Samsung, and a home core.
10) American technology content
From the point of view of the card neck, including the United States technology can not supply to the entity list of enterprises (including OEM), TSMC 7 nanometer technology of the United States technology content is less than 10%, 5 nanometer technology of the United States content is less than 3%; Samsung and SMIC America have higher technology content, so there are no OEM companies in the world that do not contain American technology. In other words, the United States can let any enterprise not get the chip, and not getting the chip means that the enterprise is in shock because of the lack of core.
11) Establish chip manufacturing that does not include US technology
This difficulty is very large, the need for a strong organizer and strong participants in the industrial chain, strong capital and technical investment, after a difficult 5-10 years to synchronize to the industry's 7, 5, 3 nanometers. Just how difficult it is.
12) Be optimistic
Moore's law has reached its limit, and the development of the limit will be very slow, with 3-nanometer mass production taking more than 3 years, and 2-nanometer and 1-nanometer taking longer.
It shows that these excellent companies will wait for some time at the end, and Chinese enterprises need to refuel.
Of course, there will be new structural development, and China should seize the opportunity to participate in the starting point and do not create a gap.
The 20th century can be said to be the century of semiconductors, but also can be said to be the century of microelectronics, microelectronics technology refers to the use of micron and submicron fine structure technology on the semiconductor single crystal material (currently mainly silicon single crystal) sheet, the development of thousands of transistors and electronic components composed of miniature electronic circuits (called chips), And by different functions of the chip assembly into a variety of microelectronic instruments, instruments and computers. Chips can also be seen as integrated circuit blocks.
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The development process of integrated circuit blocks from small scale to large scale can be seen as a process of continuous development to miniaturization. The small-scale integrated circuit developed in the late 1950s, its integration (the number of components contained in a chip) is 10 components; In the 1960s, it was developed into a medium-scale integrated circuit with an integration of 1000 components. In the 1970s, the large-scale integrated circuit was developed, and the integration reached 100,000 components; In the late 20th century, very large scale integrated circuits were developed, with an integration of more than 1 million components. Just in 1988, the United States International Business Machine Corporation (1BM) has successfully developed a storage capacity of 64 megabytes of dynamic random access memory, integrated circuit width of only 0.35 microns.