The sensor belongs to the subdivision of integrated circuit, but the difference is very big, the flexible customization demand of the sensor is large, the research and development cycle is long, the material and process are more complex, and the mass production capacity is weak.
In the future, through the design tools, model expression, testability setting and process integration and other ways to the integrated circuit, MEMS and integrated circuit Ansys, Candence custom simulation platform integration; At the same time, the IP model of sensor manufacturing is established to achieve large-scale mass production. Thirdly, the quality test method is adopted to realize the transformation of digital-analog mechanism. Through the use of these development models suitable for domestic conditions, the rapid upgrade of sensors from design to manufacturing is achieved.