1. Probe technology is a technical means of connecting the probe inside the directly exposed chip, using the physical connection method, connecting to the outside, and using the logic analyzer and other tools to collect and analyze the data to achieve debug. The chip is fixed under a high-power microscope, an imported ultra-thin probe (thin to less than 1 um) is used, and the probe can be connected to any place inside the chip, and then the internal structure of the chip is analyzed.
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2, FIB, focused ion beam analysis technology, which is currently the most fashionable, but also one of the most advanced failure analysis technology, but also one of the most advanced chip decryption technology. Its principle is that through ion implantation, any specified connection inside the chip can be disconnected or connected, and its processing accuracy reaches the nanometer level, which is already a big deal compared with the probe technology. .. In other words, as long as you know the physical location of the functional modules inside the chip, you can read any data you want. For the common MCU fuse protection anti-crack method, in the face of FIB technology is basically vulnerable.