The target material is one of the main materials for the preparation of thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials.
Sputtering target: Sputtering is a kind of physical vapor deposition (PVD) technology, which is one of the main technologies to make electronic thin film materials. It uses the ions produced by ion sources to accelerate and gather in high vacuum to form a high speed energy ion beam, bombarding the solid surface, and the kinetic energy exchange between ions and solid surface atoms. The atoms on the surface of the solid are removed from the solid and deposited on the substrate surface. The bombarded solid is the raw material for deposition of the film by sputtering method.
Ultra-high purity metal and sputtering target is an important part of electronic materials, sputtering target industry chain mainly includes metal purification, target manufacturing, sputtering coating and terminal applications, among which, target manufacturing and sputtering coating process is the key link in the entire sputtering target industry chain.
The sputtering target manufacturing process first needs to be designed according to the performance requirements of the downstream application field, and then repeated plastic deformation, heat treatment, the need to accurately control the key indicators such as grain and crystal direction, and then through welding, mechanical processing, cleaning and drying, vacuum packaging and other processes. The process involved in the manufacture of sputtering target is delicate and numerous, and the process management and manufacturing technology level will directly affect the quality and yield of sputtering target.
The primary role of the target in the semiconductor chip manufacturing process is for physical vapor deposition (PVD) or other deposition techniques to form thin films on semiconductor wafers. These films have a variety of uses in semiconductor chips, and the following are some of the main applications:
< br >
1. Conductive path: In semiconductor chips, metal films are often used to form conductive paths (also known as interconnects) to connect different parts of the chip. For example, copper and aluminum targets are often used for this purpose.
< br >
2. Barrier layer: Certain metal films (such as those formed from titanium or titanium-nitrogen targets) are used as a barrier layer to prevent the diffusion of metal atoms into the silicon substrate or other layers.
< br >
3. Contact layer: In semiconductor chips, metal films (such as those formed from titanium or tungsten targets) can be used as contact layers to improve the electrical contact between the device and the metal interconnect.
< br >
4. Gate: In devices such as field-effect transistors (FETs), metal films (such as those formed from aluminum or titanium targets) can be used as gates.
< br >
5. Capacitor electrode: In capacitor devices in integrated circuits, metal films (such as films formed from aluminum targets) can be used as electrodes.