The upstream core materials of semiconductor chips include silicon and gallium arsenide.
Silicon is one of the most widely used semiconductor materials, with mainstream performance and price advantages, is the main production material of semiconductor products; Gallium arsenide is relatively expensive, but its electrical properties are better than silicon, and it is often used in some high-performance electronic devices. In addition, with the development of semiconductor technology, in recent years, some new materials have been gradually applied to semiconductor chips, such as gallium nitride, silicon carbide, etc., these materials have better electrical and mechanical properties.
Semiconductor upstream core materials are divided into packaging materials and wafer materials.
Packaging materials include laminated board lead frame liquid sealant welding wire wafer packaging media.
Wafer materials include silicon wafer photomask photoresist polishing liquid target and so on.