The pin order of the SOP (Small Outline Package) encapsulated chip is usually determined based on design requirements and process constraints.
The exact order may vary depending on factors such as chip functionality, circuit layout, and signal transmission. In general, the package pin sequence takes into account the shortest path of signal transmission, minimum signal interference, and optimal heat distribution.
In addition, the arrangement of package pins may also be affected by standardization conventions and industry practices.
Therefore, the SOP package chip pin sequence is the result of comprehensive consideration to optimize performance, reliability and manufacturing processes.
SOP package chip pin sequence is from left to right, from top to bottom in order, usually divided into single row and double row two types. In the layout and welding process of electronic components, it is very important to correctly identify the pin sequence to avoid problems such as damaged equipment or short circuit caused by connection errors.
PN8015 is a power management chip (SOP-7 package), 1 pin :VDD chip power pin, 2 pin :FB feedback pin, 3 pin :SW high voltage MOSFET drain pin, 4 pin and 7 pin :GND ground.