The simple thing is to do high-end electronics manufacturing
It is a new interdisciplinary electronic manufacturing discipline, focusing on the high-end electronic manufacturing in the packaging and assembly of electronic information integrated circuits at wafer level, chip level, module level, board level and whole machine level. To meet the \"Made in China 2025\" electronic products miniaturization, lightweight, high density, high integration and electronic manufacturing process automation, intelligent needs as the goal, involving light, machinery, electricity, heat, materials and other disciplines, covering electronic device design, process, testing, reliability, equipment and other technical fields. It is the core and key field of modern advanced electronic manufacturing technology.
Introduction from Guilin University of Electronic Science and Technology: Since 2014, it has been renamed \"Electronic packaging Technology\" major. Electronic packaging is the external casing of the integrated circuit chip, which plays the role of placing a fixed seal, protecting the internal chip of the integrated circuit, and enhancing environmental adaptability. In the process, the rivet point on the integrated circuit chip, that is, the contact point, is welded to the pin of the package shell.
The essence of electronic packaging products is simply a protective cover for electronic products, so that electronic products are protected from the influence of the external environment. Such as physical stress, chemical corrosion.