Mobile phone chip package mainly has the following types: 1. BGA package (ball grid array package) : common in high-performance processors, with high integration and heat dissipation performance. 2. QFN package (pin-free package) : with small size, low cost and good heat dissipation performance, suitable for low-end mobile phones. 3. LGA package (pin grid array package) : suitable for high-performance processors, with high reliability and heat dissipation performance. 4. CSP package (chip-level package) : with ultra-small size and low power consumption characteristics, suitable for compact mobile phones. 5. POP package (chip stacking package) : the processor and memory chip are stacked together, improving the integration and performance. These package types play a key role in the design of mobile phone chips to meet the needs of different mobile phone products.
There are many kinds of this, for example, the cheaper leadframe, you can directly link the pad on the chip to the leadframe through the wire bond.
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Another substrate, mainly wire bond and flip chip two kinds. The former is also linked to the substrate by wiring, and the latter by doing rdl (redistributed design layer?) on the chip. Long bump, linked to substrate by bump.
1. Small form factor package 2. Four-sided flat package 3. Ball grid array package