Semiconductor packaging refers to the process of processing individual chips from tested wafers according to product models and functional requirements. The encapsulation process is: The wafer from the wafer front process is cut into a small wafer (Die) through the slicing process, and then the cut wafer is affixed to the corresponding substrate (lead frame) frame island with glue. Using ultra-fine metal (gold, tin, copper and aluminum) wire or conductive resin, the Bond Pad of the wafer is connected to the corresponding Lead of the substrate, and the required circuit is formed; Then, the independent chip is packaged with a plastic shell to protect, and a series of operations are carried out after the packaging is completed, and the finished product is tested after the completion of the packaging, usually through the Incoming inspection, Test test and packaging Packing and other processes, and finally the warehouse and shipping