Packaging is the back-end process of integrated circuit manufacturing, integrated circuit packaging is the process of further processing the wafer through the test to get an independent chip, the purpose is to add the function of the chip contact can be connected with the external circuit, such as adding pins, so that it can be connected with the external circuit such as PCB board.
At the same time, the package can add a \"protective shell\" to the chip, preventing the chip from physical or chemical damage. At the end of the packaging session, the test session will confirm the electrical function of the chip. In the production process of integrated circuits, packaging and testing are in the same link, that is, packaging and testing process.