The Chinese translation of packaging industry in China is very mixed. The speculation is about the Wire bond(WB) package and the Flip chip(FC) package.
WB package connects the chip to the package pin with a soft metal wire; The FC package is an array of chips formed through some metal bumps, which are reversed at low power and connected to the package pin. These metal bumps are either of copper-tin structure or pure tin. The package impedance of the two packages is not quite the same. The former is a traditional package with low cost. The latter is a later development of technology, low-power chip packaging form of slightly lower cost.