The difference is as follows:
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Packaging is a series of processes such as wafer slicing, mounting, bonding, and electroplating to protect the chip from physical, chemical and other environmental damage, enhance the heat dissipation performance of the chip, and lead out the input or output ports of the chip.
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Closed test is mainly to verify the function and performance of the chip, and screen out the products with structural defects, functional defects, and performance that do not meet the requirements to ensure that the delivered chip products can be used normally.
The difference between chip packaging and sealed test is that the nature of the project is not the same.
Packaging is mainly to achieve the connection and protection between the internal and external circuits of the chip.
Closed test is integrated circuit testing, which is the use of various test methods to detect whether the chip has design defects or physical defects caused by the manufacturing process.
Chip packaging and testing