Packaging technology is the process of loading the circuit pin and sealing the silicon transistor chip which is machined by photolithography and other processes. Silicon-based chips are very precise and must be isolated from the outside world to ensure that they are not affected by temperature, humidity and other factors, so they must be sealed. The many tiny circuits in the chip also need to be connected together through packaging technology to make the chip run, so the pin circuit must be loaded.
It is a process technology that wraps the memory chip to avoid contact with the outside world and prevent external damage to the chip.
Impurities and bad gases in the air, and even water vapor, will corrode the precision circuits on the chip, causing electrical performance to deteriorate.