LED packaging process chip inspection - crystal expansion - dispensing (prepare) - Manual piercing (automatic mounting) - Sintering - pressure welding - sealing - curing and post-curing - cutting and slicing - Chip inspection - Crystal expansion: 1mm to 0.6mm - Dispensing: GaAs, SiC conductive substrate, red light, yellow light, yellow green chip with back electrode, using silver glue.
< br >
For blue and green LED chips on sapphire insulating substrate, insulating adhesive is used to fix the chip. - Manual needle: under the microscope, the LED chip is stabbed to the corresponding position one by one with a needle, and a variety of chips can be changed. Automatic mounting: dispensing - installation (with bakelite nozzle to prevent scratching the surface of the current diffusion layer) - sintering: the silver glue curing, 150℃\/2H, the actual 170℃\/1H. Insulating glue generally 150℃\/1H - pressure welding: gold ball welding - burning ball\/first point\/second point; Aluminum wire pressure welding - First point\/second point\/breaking aluminum wire -- Sealing: dispensing\/filling\/molding package -- Curing and post-curing: 135℃\/1H -- Cutting and scribing: pin\/cutting, patch\/scribing -- Testing: photometry, dimensions